DXP-300LaserCoatingEquipment-1

DXP-300 Laser Coating Equipment

Composition

 

The system mainly consists of a sputtering vacuum chamber, rotating target platform, antioxidative substrate heat plate, working air circuit, air-bleed system, installation machine, vacuum measurement, electric control system and so on.

 

 

Technical Index

 

Model

DXP-300

Main Vacuum Chamber

Sphere, size: Ø300mm

Configuration of Vacuum System

Mechanical pump, molecular pump, slide valve

Ultimate Pressure

≤6.67*10-5Pa (after bake and degassing)

Time of Recovery Vacuum

Reach 5*10-3Pa in 20 mins ( expose in air for short time and inflate dry chlorine and then begin air exhaust)

Rotating Target Platform

Target size: Ø30, could install 4 pieces targets for one time, could achieve revolution change target and each target could achieve rotating. Rotating speed: 5-60 rpm

Substrate Heat Plate

Sample Size

1 inch

Mode of Motion

The substrate could continuously rotate. revolving speed: 5-60rpm

Heat

MAX. heat temperature of substrate 800℃±1℃

Air Circuit System

Quality flow controller 1 channel

Laser beam scanning device

Two-dimension scanning mechanical stage, carry out two freely scanning

Computer Control System

It controls the revolution target plate, rotation of target, rotation of sample, control temperature of the sample, laser beam scanning and so on.

Floor Space

Mainframe

850*850mm2

Electric Control Cabinet

700*700mm2(1 set)

DXP-300 Laser Coating Equipment is for preparing superconducting thin films, semiconductor films, ferroelectric films and so on. It is suitable for the thin-film material scientific research and small batch preparation of universities and research institutions.
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