Magnetron Sputtering System
Composition
The system mainly consists of a sputtering vacuum chamber, permanent magnetron sputtering target (three targets), monocarpic heater, DC power supply, radio-frequency power supply, working gas circuit, pumping system, vacuum measurement, electronic control system and installation cabinet.
Technical Index
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Model |
DXT-450 |
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Sputtering Vacuum Chamber |
Cylindrical front opening door structure, size: Ø450*400mm |
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Configuration of Vacuum System |
Compound molecular pump, mechanical pump, pneumatic slide valve, imported SMC cylinder throttle |
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Ultimate Pressure |
≤6.6*10-6Pa (after bake and degassing) |
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Time of Recovery Vacuum |
25 mins could achieve 6.6*10-4Pa ( expose in air and inflate dry chlorine and then begin air exhaust |
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Component of Permanent Magnetron Sputtering Targets |
Three permanent targets, target size: Ø60mm (One among them could sputter magnetic material.) Radio sputtering of each target and direct current sputtering are compatible. Intarget water cooling, Three targets could deflect to above sample center together. The distance between target and sample is 90-130mm, which is adjustable. Each target equipped with imported SMC rotating Pneumatic baffle. |
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Monocrepid Heater |
Sample Size |
Ø4 inches |
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Mode of Motion |
Substrate could continuously rotate, revolving speed: 0-30 rpm |
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Heat |
Heat imported heater strip, MAX. heat temperature 600℃±1℃ |
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Baffle Form |
Imported SMC corner cylinder control |
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Air Circuit System |
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Computer Control System |
Adopt PLC+ Industrial Personal Computer+ touch screen automatic control mode |
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*Accessories for Choice |
Film thickness gauge, pump, cooling water cycle machine |
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Floor Space |
Mainframe:1m*1.8m, electric control cabinet:0.9m*0.6m |
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