Pyriform Single Chamber Magnetron Sputtering System
Composition
The system mainly consists of the sputtering vacuum chamber, magnetron sputtering target, substrate water-cooling heat revolution plate, working gas circuit, pumping system, installation cabinet, vacuum measurement and electronic control system.
Technical Index
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Model |
DXJ-560D |
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Sputtering Vacuum Chamber |
Pyriform sputtering vacuum chamber size: Ø560*350mm |
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Configuration of Vacuum System |
Compound molecular pump, mechanical pump, slide valve |
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Ultimate Pressure |
2.0*10-5Pa (after bake and degassing) |
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Time of Recovery Vacuum |
System is exposed in air and inflated dry chlorine and then begins air exhaust in short time. It could reach 6.6*10-4Pa in 40 mins. |
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Component of Permanent Magnetron Sputtering Targets |
Five permanent targets, target size: Ø60mm (One among them could sputter magnetic material.) Radio sputtering of each target and direct current sputtering are compatible. The distance between target and sample is 40-80mm, which is adjustable. |
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Substrate Water-cooling Heat Revolution Plate |
Substrate Structure |
6 stations and one for installation of heating furnace other for water cooling substrate plate |
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Sample Size |
Ø30 mm. It could accept 6 pieces |
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Mode of Motion |
0-360° back and front rotating |
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Heat |
MAX. heat temperature of substrate 600℃±1℃ |
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Negative Substrate Bias |
-200V |
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Air Circuit System |
Quality flow controller 2 channel |
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Computer Control System |
Control rotation of sample, switch of baffle and confirmation of target place |
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Floor Space |
Mainframe |
1300*800mm2 |
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Electric Control Cabinet |
700*700mm2(2 sets) |
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