Single Chamber Magnetron Sputtering System

Model

DXJ-450D

Size of Vacuum Chamber

Cylindrical vacuum chamber size: Ø450*350mm

Configuration of Vacuum System

Compound molecular pump,  mechanical pump, slide valve

Ultimate Pressure

≤6.67*10^-5Pa (after bake and degassing)

Time of Recovery Vacuum

Reach 6.6*10-4Pa in 40 mins ( expose in air for short time and inflate dry chlorine and then begin air exhaust)

Component of Permanent Magnetron Sputtering Targets

Three permanent targets, target size: Ø60mm (One among them could sputter magnetic material.) Radio sputtering of each target and direct current sputtering are compatible. Three targets could deflect to above sample center together. The distance between target and sample is 90-110mm, which is adjustable. When sputtering upwards, the distance between target and sample is 40-80mm

Single Substrate Water-cooling Heat Plate

Substrate Structure

Substrate heating and water cooling work independently for each other. Taking down the heating furnace could install water cooling substrate plate.

Sample Size

Ø30 mm

Mode of Motion

Substrate could continuously rotate. revolving speed: 5-10 rpm

Heat

MAX. heat temperature of substrate: 600℃±1℃

Negative Substrate Bias

-200V

Air Circuit System

Quality flow controller 2 channel

Computer Control System

Control rotation of sample, switch of baffle, confirmation of target place and so on

*Accessories for Choice
6 Stations Substrate Revolution Plate

Removing single substrate water cooling heating plate could install this plate. It could be placed 6 pieces 30mm substrates. One among 6 stations for installation of heating furnace, other for water cooling substrate plate or natural cooling. MAX. heat temperature of substrate is 600℃±1℃.

Floor Space

Mainframe

1300*800mm²

Electric Control Cabinet

700*700mm²(2 sets)