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Physical Vapor Deposition Equipment

What is physical vapor deposition equipment?

Physical vapor deposition(PVD) equipment is a preparation equipment that uses physical processes to achieve material transfer, transferring atoms or molecules from the source to the surface of the substrate.
Physical vapor deposition(PVD) refers to vaporizing the surface of the material source and depositing it on the surface of the substrate through low-pressure gas/plasma, including evaporation, sputtering, ion beam, etc.

Advantages of PVD coating

Simple - the principle is simple, no chemical reaction is involved in the preparation, only the material transfer of molecules or atoms is involved;
Controllable - the deposition rate and film thickness can be controlled by temperature, angle, distance, power and other methods;
Safe - no toxic, harmful, flammable or explosive gases are involved in the preparation during the coating process.

Product categories of PVD coatings

Magnetron sputtering coating system - Magnetron sputtering is an essential experimental method for preparing low-dimensional and nano-thin film material devices, and is widely used in integrated circuits, photonic crystals, low-dimensional semiconductors and other fields.

Laser coating equipment - Laser coating is to introduce pulsed laser into the vacuum chamber through the synthetic selective wavelength quartz window to irradiate the film-forming target. After the target is irradiated, it absorbs high-density energy to form a plasma-like plasma state, which is then deposited on the sample substrate on the opposite side to form a film. The laser coating method can obtain artificial synthetic new materials with a composition and structure that is quasi-stable in thermodynamic theory, which are used to prepare superconducting films, semiconductor films, ferroelectric films, superhard films, etc.

Evaporation coating equipment - Evaporation coating is to heat the evaporation container in a vacuum chamber so that the raw materials inside it are vaporized and escape from the surface in the form of atoms or molecules, forming a vapor flow to the surface of the opposite sample (called substrate or substrate) to condense to form a solid film.

Electron beam evaporation coating equipment - The energy of the electron beam evaporation source can be highly concentrated, so that the coating material can be locally heated to a high temperature and evaporated. By adjusting the power of the electron beam, the evaporation rate of the coating material can be easily controlled, which is especially beneficial for high melting point and high purity metals and compound materials.

DXMS-450C Magnetron Sputtering Coating System

 Case 1 

DXMS-450C Magnetron Sputtering Coating System

System composition:

Pear-shaped sputtering coating chamber, 1 set

   ●  Size: Φ450㎜×460㎜;
   ●  Electric large flange cover above the vacuum chamber, 1 piece;
   ●  Two 4-inch magnetron sputtering target interfaces on the base plate, and the target head can be adjusted;
   ●  CF150 flange interface is used to connect the vacuum system and vacuum measurement interface;
   ●  Two pieces of observation windows and corresponding baffles.

Vacuum acquisition and measurement
The sputtering coating chamber adopts FF620 turbomolecular pump+-8L/s mechanical pump, with an ultimate vacuum better than 8×10-5Pa, measured using a domestic digital composite vacuum gauge, and the molecular pump port valve is a GV150 manual gate valve.

Sample Holder Assembly:

   ●  Dimensions of substrate table Φ150mm, one 2-6-inch substrate or several small substrates can be placed at a time;
   ●  The maximum heating temperature of the substrate platform is ≥500 ℃;
   ●  The substrate can rotate autonomously, and the speed is controllable and adjustable within the range of 2-10 revolutions per minute;
   ●  1 set of sample baffle;
   ●  The heater is made of oxidizable material;
   ●  Select a temperature control table of a Japanese brand;
   ●  A negative bias voltage of 0-200 volts will be applied.

Magnetron Sputtering Target

   ●  Two pieces of Φ4 inch magnetron targets, which are installed on the bottom plate of the vacuum chamber, with adjustable target angle, compatible with RF and DC, water-cooled, and capable of single or double target sputtering coating;
   ●  Uniformity within the 5-inch effective coating area ≤±5%;
   ●  Uniformity within the 2-inch effective coating area ≤±3%.

Inflation gas path: 
There are three intake gas paths for mass flow meters (made in China) in the coating room, achieving control of working gas intake for argon and oxygen. Additionally, there is one nitrogen gas path. Three channels of gas enter the coating chamber through one CF16 ultra-high vacuum shut-off valve.

Coating power supply:

   ●  One Set of RF Power Supply, with a power of 500W, capable of automatic matching (made in China);
   ●  One DC power supply, with a power of 1000W (made in China).

Frame (rack), 1 set

System Control:

   ●  Power supply: 380V/50Hz three-phase five wire power supply system with leakage protection. Grounding wires for equipment and electrical control cabinets.
   ●  Two international standard power cabinets are equipped, which are installed with: 1 set of main control power supply, 1 set of digital composite vacuum gauge, 1 set of sample rack heating temperature control power supply, 1 set of sample rack drive power supply, 1 set of vacuum chamber lighting power supply, 1 set of molecular pump power supply, 1set of RF power supply for coating, and 1 set of DC power supply for coating.

 Case 2 

DXMC-500A Electron Beam Coating System

DXMC-500A Electron Beam Coating System

DXMC-500A Electron Beam Coating System mainly completes the coating of some metals, especially refractory metals and some oxide materials. It uses an electron beam deflection of 270º to heat and evaporate the materials, and is equipped with a glow discharge cleaning rod for plasma discharge cleaning.

The experimental purpose of the DXMS-450C Magnetron Sputtering Coating System is to prepare thin films with nano and micro structures. Such as metal, semiconductor, dielectric, oxide, nitride and other nano films. The working mode of this system is single target independent operation, take turns working, and dual target co splashing.

Main Technical Parameters:

1．    The vacuum chamber is made of SUS304 stainless steel, with a size of Φ 500mm × 600 (H) mm, front door open, with observation window on the door to observe the electronic gun and workpiece.
2．    There is one set of e-type 10Kw electronic gun and pneumatic baffle at the bottom of the vacuum chamber.
3．    Vacuum system: Adopting molecular pump+mechanical pump vacuum unit, adopting high precision pneumatic cover valve, vacuum control has interlocking protection function, at least including: high valve and pre extraction interlock, high valve and inflation interlock, pre extraction and pre stage interlock, pre extraction and inflation interlock, etc. It has the functions of water, gas, and phase failure alarms.
4．    Equipped with two sets of thermal evaporation source, working in rotation

         The system is configured according to the turbo molecular pump system:

         ●  One Set of FF-200/1200 turbomolecular pump
         ●  One Set of GV200 pneumatic flap valve
         ●  One Set of 8L/s mechanical pump
         ●  Two Sets of Dg40 solenoid valves
         ●  Ultimate Vacuum: 5×10-7 Torr
         ●  Recovery time: pumped from atmosphere to 5×10-6 Torr ≤40min
5．    Digital Display Composite Vacuum Gauge, made in China
6．    Central control system: Siemens PLC and touch screen are used for centralized control, integrating vacuum control, baking control, rotation control, evaporation, internal baking, lighting, and fault alarm into one panel.
Fixture mechanism: There is a rotating frame mechanism above the vacuum chamber, which can hold a 4-inch or 6-inch substrate and rotate automatically, and the uniformity within effective coating area ≤±3%.
7．    The speed of the fixture is 0-10rpm, with 1 quartz crystal film thickness gauge interface and 1 Chinese made film thickness gauge configured.
8．    Baking: There is baking heating above the workpiece rack, controlled by a digital temperature controller, with a maximum temperature of 350 ℃.
9．    Regarding the electronic gun section:
         Main Technical Parameters:

         ●   A 10Kw electronic gun
         ●   Electron beam deflection angle 270 º
         ●   The crucible of the electron gun is a six hole water-cooled copper crucible that can be electrically transposed.
         ●   Automatic reset of high-voltage arc extinguishing for gun power supply.
         ●   Cooling water: flow rate ≥ 10L/min, water pressure ≥ 0.15Mpa,  inlet water temperature ≤ 25 ℃.
10．    Quartz crystal film thickness gauge: Adopting a film thickness controller made in China, it can automatically control the evaporation rate of the electron gun and the action of the baffle after setting the coating parameters.
11．    Configure one high-pressure cleaning rod for plasma glow discharge cleaning.
12．    MFC mass flow meter: 1 set (1 circuit) Chinese product.
13．    Rack: 1 unit, with a stainless steel cover and 3 plastic spray panels, the overall appearance of the rack is beautiful. Host size: 1300mm×1200mm×1600 mm.
14．    One electric control cabinet with a specification of 700×700×1760 mm.